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Thermally conductive flexible materials for electrical applications

von Thomas Rappelt, Chandrashekar Raman, Bettina Kaiser

Thermal overloading, so-called “hot spots” are the most frequent cause of failure of electronic components. The increasing trend of miniaturisation intensifies this problem and drives the development of materials, which make the dissipation of the generated heat possible.

By the use of special fillers it is possible to specifically modify plastic materials in such a way that good thermal conductivity and good electrical insulation are achieved at the same time.
Thus heat conducting plastic housing has been already used that protects electronic components from overheating. In order to further improve the heat conduction, development work is currently underway to obtain flexible thermally conductive materials that can be used as a seal for the housing.