Written on 04.11.2011 - Technology
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DuPont introduces Kalrez 9300 and 9500 perfluoroelastomer parts to seal demanding plasma etch and deposition processes

The introduction of DuPont Kalrez 9300 and 9500 perfluoroelastomer parts for sealing remote and in situ plasma etch processes, and for demanding deposition processes where ozone is prominent, were two of the highlights of the company's multi-product and technology offerings to semiconductor wafer processors at Semicon Europa 2011.

Fig. 1: Kalrez 9300 demonstrates lower weight loss than other perfluoroelastomer (FFKM) parts.

DuPont has developed Kalrez 9300 perfluoroelastomer parts for chip manufacturers who utilize oxygen (O₂) and fluorine-based (CF4) plasma for wafer etch, to overcome the unacceptable erosion of seals exposed to aggressive processing or cleaning chemistry. Unlike many elastomers that typically erode and cause unwanted particles in such ion-rich environments, Kalrez 9300 perfluoroelastomer parts offer exceptional sealing performance in a variety of challenging etch conditions (fig. 1). The DuPont perfluoroelastomer part allows chip manufacturers to use one product to solve a variety of sealing issues where previously several were required.

Kalrez 9300 parts are based on a proprietary crosslinking and mechanical reinforcement system developed from DuPont.

Kalrez 9500 has been developed specifically to resist the aggressive process chemistry used by chip manufacturers in SACVD and ash/strip processes, by demonstrating ultra-low weight loss in remotely generated plasma, and good resistance to ozone, ammonia and water vapour. A product of DuPont proprietary technology, Kalrez 9500 has better resistance to oxygen and fluorine radicals that can erode traditional seal materials, good heat resistance with very low outgassing, and has a maximum continuous service temperature rating of 310 °C.