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14. January 2021

PolymaxTPE: Bondable TPE for electronic components

PolymaxTPE announced that the company has developed a new TPE product that is said to outperform commonly used TPUs and compounds such as TPSiV in electronic components. The material is described as being abrasion resistant, odour-free and with excellent chemical adhesion to PC and ABS, as well as blends and alloys of these thermoplastics. The material is well suited in any application where an item is handled frequently in an abusive environment such as protective cases and on wearable technology.

PolymaxTPE has developed a new TPE for demanding applications in electronic components. (Source: PolymaxTPE)

PolymaxTPE has developed a new TPE for demanding applications in electronic components. (Source: PolymaxTPE)

“With the experience and technical knowledge at PolymaxTPE, we understand the reaction between a demanding operational environment and the ingredients required in an elastomer formulation,” said Tom Castile, vice president of sales at PolymaxTPE. “This allows us to develop a customized product that meets the requirements of the application with excellent processing performance at a competitive cost.”

The TPE is designed to be moulded in two-stage or insert moulding processes. It offers good mould flow characteristics and part demoulding, allowing for manufacturing efficiencies.

“Our solution is easily colourable and has strong UV stability with no loss of adhesion to the rigid substrate when exposed to sweat, grime or conventional topical lotions, commonly used by consumers, making our TPE technology an ideal replacement for TPUs and TPSiVs,” said Castile.

The new product is an extension of the PolymaxTPE A-Series, which is designed specifically for bonding to polycarbonate, ABS and other engineering resins.

www.polymaxtpe.com

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