Arburg focusses on packaging and electronic applications at Chinaplas

The packaging version of the hybrid Allrounder 570 H produces four IML tubs in a cycle time of approximately 4 s. The machine features a clamping force of 1,800 kN and a size 800 injection unit. It is equipped with an IML system from French automation and in-mould labelling specialists Sepro Robotique and Machines Pagès.

The four-cavity mould from Swiss manufacturer Kebo was adapted for the high-speed production of IML tubs, while the labels come from Belgian supplier Verstraete.The hotmelt process for overmoulding electronic components will be demonstrated on a vertical Allrounder 275 V with a clamping force of 250 kN and a size 100 injection unit. The hotmelt adhesives can be used over a wide range of temperatures and feature excellent adhesion on polar plastics.

This makes them highly suitable for overmoulding sensitive electronic components, as found in the automotive sector for example. The low mould cavity pressures required for injection moulding are a major advantage due to the extremely low melting viscosity of the material.This means that the sensitive “inner workings” of the components remain undamaged and are protected from environmental influences.

An LED carrier will be produced as a demonstration part, with the insert consisting of an LED circuit board and two connector cables. The screw that has been adapted to process the material features a diameter of 35 mm and the injection moulding cylinder is equipped with a needle shut-off nozzle. With the 1+1-cavity mould used, the cycle time is around 110 s, which is ideal for a simultaneous manual insertion process.

Arburg at Chinaplas: hall E1, stand G 01