NPE2012: Dow commits to underwrite Antec program, SPI Technical Education program, and Technology Central

Dow will be the exclusive corporate sponsor of the Technical Education Program and Technology Central at NPE2012.

SPI announced, that Dow will be the exclusive corporate underwriter of Antec 2012, which will be co-located with the NPE trade show. The world’s biggest plastics conference will include more than 500 original peer-reviewed technical presentations.
In addition, Dow will sponsor what SPI has dubbed Technology Central in the North-South Hall of the OCCC. This will include SPI’s 2nd International Plastics Design Competition, four multi-exhibitor specialty pavilions, and a technology theater for presentations and demonstrations by exhibitors.

In addition Dow will directly participate in NPE2012 and Antec with:

  • 14 technical papers at Antec
  • On-site processing of Dow’s resins. At least 8 machinery manufacturers will be demonstrating production on the exhibit floor.

“Dow’s extensive involvement in the major NPE2012 programs is a way for us to support the industry and keep it strong, innovative, and growing,” said Mauro Gregorio, Commercial Vice President for Dow’s North America Performance Plastics. “We are particularly interested in the emphasis on innovation woven throughout many of the programs planned for NPE and we will make our contribution through presentations on a number of relevant topics.”

“Dow’s extensive participation in NPE2012 reflects a strong involvement by resin manufacturers in general,” said Gene Sanders, SPI Executive Vice president of Trade Shows and Conferences. “Participation by these companies will be greater than it was at NPE2009 and include not just booths on the show floor but also customer hospitality centers nearby in the convention center, conference presentations, and special-program displays.”


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