• Written on 09.04.2013 - Technology
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Rampf at Chinaplas 2013

Rampf Dosiertechnik will be exhibiting the DC-CNC 800 low-pressure mixing and dispensing system at the trade fair Chinaplas from 20 – 23 May 2013 in Guangzhou, China. The compact dispensing cell will use Raku-PUR Speed Technology to apply a foam gasket from Rampf Giessharze on site.

According to Rampf Dosiertechnik, the DC-CNC 800 low-pressure mixing and dispensing cell is the optimum solution for the 2D or 3D application of casting, sealing, and adhesive systems. The basic set-up of the cell is equipped with an integrated control cabinet and can be fitted with piston pumps or gear pumps.

The DC-CNC 800 low-pressure mixing and dispensing system offers several new features.

The DC-CNC 800 low-pressure mixing and dispensing system offers several new features.

Further features include the Siemens Sinumerik modular control system and integrated process control for continuous monitoring of pressure, fill level and speed. The mixing and dispensing system can optionally be equipped with a high-pressure rinse agent recycling system, high-pressure water rinsing or various items of automation equipment, depending on the application in question.

The DC-CNC 800 is an updated and enhanced version of the DC-CNC model. New developments include standardised operating concepts for the sliding table, rotary index plate, and conveyor feed. The system also features improved material preparation with larger tanks, meaning that small containers can be fully filled in one step. The improved material preparation system also ensures more material-friendly homogenisation and faster degassing. Accessibility has also been significantly improved for maintenance work on the dispensing pumps and controls, says the company.

At this year’s Chinaplas, the DC-CNC 800 system will use Raku-PUR Speed Technology to apply a foam gasket from Rampf Giessharze on site. This material features low water absorption, good mechanical strength and high heat resistance. Because the material is tack-free in less than three minutes, the sealed component is quickly ready for further processing.

 


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