Arburg at Chinaplas 2014

“With their strong growth rates, the markets in China and Asia are very important for us. We are therefore active at the local level here and have, for example, significantly improved customer support with our distribution warehouse near Shanghai, which we opened in 2013. We are in a position to deliver individually adapted Allrounders and Multilift robotic systems much faster than before in the region. The high level of customer satisfaction confirms that we have made absolutely the right choice,” says Helmut Heinson, Managing Director Sales, adding: “Because of the dynamic technical development in these countries, we regard the Chinaplas as an important presentation forum for our high-end injection moulding solutions.”

“Thanks to their modularity, our Allrounder injection moulding machines can be equipped for specific applications or industries. We will be showing sophisticated examples of this at the Chinaplas 2014, with exhibits for the packaging and electronics industry,” says Zhao Tong, manager of the Arburg subsidiary in Shanghai. “We will use the production of high quality ML packaging application and the Hotmelt process to make it clear to visitors that we are able to meet all our customers’ requirements.”

Max Man, Managing Director of the Arburg subsidiaries in Shenzhen and Hong Kong, explains: “The Asian market increasingly demands solutions that are characterised by high performance, automation and customisation and that can be made available quickly. This is exactly what we offer our customers, plus comprehensive pre- and after-sales service. This is very much appreciated by our customers, both local and international.”

The packaging version of the hybrid Allrounder 570 H produces four IML tubs in a cycle time of approx. 4 s. The machine features a clamping force of 1,800 kN and a size 800 injection unit. It is equipped with an IML system from French automation and in-mould labelling specialists Sepro Robotique and Machines Pagès. The four-cavity mould from Swiss manufacturer Kebo was adapted for the high-speed production of IML tubs, while the labels come from Belgian supplier Verstraete.

The hotmelt process for overmoulding electronic components will be demonstrated on a vertical Allrounder 275 V with a clamping force of 250 kN and a size 100 injection unit. The hotmelt adhesives can be used over a wide range of temperatures and feature excellent adhesion on polar plastics. This makes them highly suitable for overmoulding sensitive electronic components, as found in the automotive sector for example. The low mould cavity pressures required for injection moulding are a major advantage due to the extremely low melting viscosity of the material. This means that the sensitive “inner workings” of the components remain undamaged and are protected from environmental influences.

An LED carrier will be produced as a demonstration part, with the insert consisting of an LED circuit board and two connector cables. The screw that has been adapted to process the material features a diameter of 35 mm and the injection moulding cylinder is equipped with a needle shut-off nozzle. With the 1+1-cavity mould used, the cycle time is around 110 s, which is ideal for a simultaneous manual insertion process.